Coplanar die to substrate bond method
US4792533A · kind A · utility
5Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1987 |
| Grant date | Dec 20, 1988 |
| Priority date | — |
| Expiry date | Mar 13, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding die to substrates coplanarly in a multichip module assembly. After the die are aligned into die openings of the substrate, a glass slurry is applied and the module is fired to solidify the glass. Because of shrinkage of the glass slurry firing, a groove results between the die and the substrate. To fill on this groove, a polyimide or like film is adhered and then pressed and cured on the surface of the die and substrate. This film is used as a base for interconnect lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.