Steven S. Chiang
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Dec 3, 2001 → Dec 3, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6969635B2 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Electricity | 100 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.