Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US6969635B2 · kind B2 · utility
100Cited by
54References
134Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2001 |
| Grant date | Nov 29, 2005 |
| Priority date | — |
| Expiry date | Jun 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.