Su-Ping Chiu
1Patents
1h-index
1Co-inventors
22Inventor score
Filing activity: Feb 5, 2005 → Feb 5, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7253093B2 | Method for fabricating interconnection in an insulating layer on a wafer | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.