Susan Bumgarner
2Patents
2h-index
5Co-inventors
30Inventor score
Filing activity: Jun 29, 2005 → May 8, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7547623B2 | Methods of forming lead free solder bumps | Electricity | 7 | Active |
| US7839000B2 | Solder structures including barrier layers with nickel and/or copper | Electricity | 7 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.