Sushil Agarwal
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Nov 7, 2002 → Nov 7, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7406042B1 | Method and apparatus for dynamic multi-line bonding in communication systems | Electricity | 9 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.