Patent · US Active

Method and apparatus for dynamic multi-line bonding in communication systems

US7406042B1 · kind B1 · utility

9Cited by
10References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 7, 2002
Grant dateJul 29, 2008
Priority date
Expiry dateSep 5, 2026

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH04L41/5003
  • WIPO fieldDigital communication
  • WIPO sectorElectrical engineering

Abstract

A bundler, un-bundler and sequencer for use in controlling and driving opposing sets of logical or physical modems to drive multiple-subscriber lines with multiple communication channels. The sequencer determines subscriber requirements such as maximum and minimum bandwidth and quality of service. The sequencer also determines bandwidth availability and status of multiple subscriber lines from which a bundle may be formed. The bundler couple to the sequencer and implement header or headerless insertion of multiple channels in round robin sequence into the X-DSL frames at data rates which correspond with subscriber requirements. The un-bundler reverses the process of the bundler and passes the appropriate packet data onto the corresponding network.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.