Syuzo Aoki
8Patents
3h-index
13Co-inventors
50Inventor score
Filing activity: May 26, 2006 → Mar 29, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9933822B2 | Electronic component case and electronic component device | Electricity | 7 | Active |
| US8213182B2 | Housing case for housing electronic circuit board, and electronic apparatus | Electricity | 7 | Active |
| US7483273B2 | Semiconductor module and semiconductor module heat radiation plate | Electricity | 6 | Active |
| US9332659B2 | Electronic component case and electronic component device | Electricity | 2 | Active |
| US9101981B2 | Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating component | Emerging Cross-Sectional Technologies | 2 | Active |
| US9476138B2 | Composite plating liquid | Chemistry; Metallurgy | 1 | Active |
| US9920232B2 | Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating component | Emerging Cross-Sectional Technologies | 1 | Active |
| US9136200B2 | Heat radiating component and method of producing same | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.