Heat radiating component and method of producing same
US9136200B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Sep 9, 2011 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Nov 4, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12389
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.