Tadami Ito
1Patents
1h-index
1Co-inventors
22Inventor score
Filing activity: Mar 14, 1996 → Mar 14, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5777380A | Resin sealing type semiconductor device having thin portions formed on the leads | Electricity | 22 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.