Resin sealing type semiconductor device having thin portions formed on the leads
US5777380A · kind A · utility
22Cited by
26References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Mar 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin sealing type semiconductor device includes a radiator, a semiconductor element, a frame lead arranged at a distance around this semiconductor element and displaced from the radiator, and a plurality of leads extending from this frame lead and attached to a mounting surface with a insulating lead support therebetween. The leads are pressed downward by an upper mold so that the radiator is pressed against a lower mold in such a manner that resin cannot seep therebetween. Thin portions are formed in the leads to ensure that the leads do not peel away from the insulating lead support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.