Taizo Kise
1Patents
1h-index
7Co-inventors
25Inventor score
Filing activity: Jan 8, 2007 → Jan 8, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7544587B2 | Wafer dividing method and wafer dividing apparatus | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.