Wafer dividing method and wafer dividing apparatus
US7544587B2 · kind B2 · utility
1Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2007 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Jan 8, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/325
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.