Takeo Kanazawa
2Patents
2h-index
2Co-inventors
27Inventor score
Filing activity: Mar 23, 1998 → Feb 11, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6030512A | Device for forming bumps by metal plating | Electricity | 12 | Expired |
| US6413404B1 | Method of forming bumps by electroplating | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.