Thierry Mourier
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Jun 17, 2014 → Jun 17, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9224796B2 | Process for producing a through-silicon via and a through-silicon capacitor in a substrate, and corresponding device | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.