Thomas A. Dotolo
2Patents
1h-index
6Co-inventors
33Inventor score
Filing activity: Jun 27, 2003 → May 8, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7670437B2 | Mask and substrate alignment for solder bump process | Electricity | 5 | Active |
| US7410919B2 | Mask and substrate alignment for solder bump process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.