Mask and substrate alignment for solder bump process
US7410919B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2003 |
| Grant date | Aug 12, 2008 |
| Priority date | — |
| Expiry date | Oct 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/04953
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for of aligning a mask to a substrate comprising: a fixture for holding the mask and the substrate in fixed positions relative to each other; means for holding the substrate, the means for holding the substrate protruding through openings in a table and the fixture, the means for holding fixedly mounted on a stage, the stage moveable in first and second directions and rotatable about an axis relative to the table; means for affixing the fixture containing the mask and the substrate to the table; means for controlling the means for temporarily affixing so as to generate a uniform force around a perimeter of the fixture to effectuate the temporarily affixing; means for aligning the mask to the substrate, the means for aligning controlling movement of the stage in the first and second directions and rotation about the axis; and means for fastening the fixture together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.