Thomas G. Bensing
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: May 21, 2008 → May 21, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7598760B1 | High temperature ceramic die package and DUT board socket | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.