High temperature ceramic die package and DUT board socket

US7598760B1 · kind B1 · utility

Assignee

• QualiTau, Inc. · US

Inventors

• Thomas G. Bensing · Sunnyvale, US
• Adalberto M. Ramirez · Hayward, US
• Jens Ullmann · Oberkochen, DE
• Jacob Herschmann · Palo Alto, US
• Robert J. Sylvia · Santa Clara, US
• Maurice C. Evans · Oakland, US

Key dates

• Filing date: May 21, 2008
• Grant date: Oct 6, 2009
• Expiry date: May 21, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one “well” location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).