Thomas Gorczyca
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Nov 30, 1995 → Nov 30, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5866952A | High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate | Electricity | 143 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.