Thomas Lamothe
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Jan 9, 1995 → Jan 9, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5517127A | Additive structure and method for testing semiconductor wire bond dies | Emerging Cross-Sectional Technologies | 33 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.