Additive structure and method for testing semiconductor wire bond dies
US5517127A · kind A · utility
33Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1995 |
| Grant date | May 14, 1996 |
| Priority date | — |
| Expiry date | Jan 9, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A structure and method for achieving burn-in and full functional testing of a semiconductor wire bond die are provided. The structure comprises an electrical conductor which connects a wire bond pad to a solderable test contact laterally displaced from the wire bond pad. The solderable test contact is configured to facilitate electrical connection of an external testing device thereto for electrical testing and/or burn-in of integrated circuitry associated with the die, without direct physical contact to the wire bond pads. The structure does not need to be removed following the burn-in or test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.