Tiger Tai
1Patents
0h-index
5Co-inventors
19Inventor score
Filing activity: Sep 14, 2017 → Sep 14, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11031371B2 | Semiconductor package and method of fabricating semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.