Inventor · Singapore, SG

Tim Teoh

2Patents
2h-index
6Co-inventors
30Inventor score

Filing activity: Aug 29, 2000 → Sep 30, 2002

Most-cited inventions

PatentTitleAreaCited byStatus
US6617201B2 U-shape tape for BOC FBGA package to improve moldability Electricity 5 Expired
US6486536B1 U-shape tape for BOC FBGA package to improve moldability Electricity 3 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.