Timothy L. Deeter
6Patents
5h-index
13Co-inventors
56Inventor score
Filing activity: Nov 27, 1991 → Jun 29, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6525419B1 | Thermally coupling electrically decoupling cooling device for integrated circuits | Electricity | 39 | Expired |
| US6081272A | Merging dummy structure representations for improved distribution of artifacts in a semiconductor layer | Electricity | 34 | Expired |
| US5270256A | Method of forming a guard wall to reduce delamination effects | Electricity | 29 | Expired |
| US6646340B2 | Thermally coupling electrically decoupling cooling device for integrated circuits | Electricity | 14 | Expired |
| US7787292B2 | Carbon nanotube fuse element | Electricity | 7 | Active |
| US5986315A | Guard wall to reduce delamination effects within a semiconductor die | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.