Todd G. Backer
3Patents
2h-index
9Co-inventors
33Inventor score
Filing activity: Dec 20, 1991 → Oct 13, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5665639A | Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal | Electricity | 78 | Expired |
| US5646804A | Thin film magnetic head having polymer on broken flux guide sections, method of producing and integrated structure incorporating same | Physics | 5 | Expired |
| US5946169A | Soft adjacent layer vertically biased magnetoresistive sensor having improved sensor stability | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.