Toshiki Kida
4Patents
1h-index
11Co-inventors
37Inventor score
Filing activity: Feb 8, 2008 → Dec 5, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7939938B2 | Functional device package with metallization arrangement for improved bondability of two substrates | Electricity | 1 | Active |
| US9741477B2 | Sintered body for varistor, multilayer substrate using same, and production method for these | Electricity | 1 | Active |
| US8686827B2 | PTC element and heating-element module | Chemistry; Metallurgy | 0 | Active |
| US8766145B2 | Process for producing semiconductive porcelain composition and heater employing semiconductive porcelain composition | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.