Inventor · 白石町, JP

Toshio Naritomi

1Patents
1h-index
2Co-inventors
22Inventor score

Filing activity: Jul 10, 1989 → Jul 10, 1989

Most-cited inventions

PatentTitleAreaCited byStatus
US5051375A Method of producing semiconductor wafer through gettering using spherical abrasives Emerging Cross-Sectional Technologies 7 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.