Trac Nguyen
3Patents
2h-index
5Co-inventors
30Inventor score
Filing activity: May 9, 1994 → Oct 7, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5622895A | Metallization for polymer-dielectric multichip modules | Electricity | 39 | Expired |
| US5466972A | Metallization for polymer-dielectric multichip modules including a Ti/Pd alloy layer | Electricity | 5 | Expired |
| US5779929A | Thin film metallization for barium nanotitanate substrates | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.