Thin film metallization for barium nanotitanate substrates
US5779929A · kind A · utility
2Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1996 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Oct 7, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The specification describes a metallization system for barium nanotitanate substrates that provides a combination of high dielectric properties and excellent metal adhesion. It comprises Ti, Pd or Ti/Pd alloy, and copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.