Tracy C. Peterson
1Patents
1h-index
7Co-inventors
25Inventor score
Filing activity: Feb 1, 2012 → Feb 1, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8597985B1 | MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads | Performing Operations; Transporting | 7 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.