Patent · US Active

MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

US8597985B1 · kind B1 · utility

7Cited by

3References

16Claims

0Family size

Assignee

Sandia Corporation · US

Inventors

Rajen Chanchani · Albuquerque, US
Christopher Nordquist · Albuquerque, US
Roy H. Olsson · Albuquerque, US
Tracy C. Peterson · Albuquerque, US
Randy J. Shul · Albuquerque, US
Catalina Ahlers · Albuquerque, US
Thomas A. Plut · Albuquerque, US
Gary A. Patrizi · Albuquerque, US

Key dates

Filing date	Feb 1, 2012
Grant date	Dec 3, 2013
Priority date	—
Expiry date	Feb 1, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/035
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predetermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.