TSENG-CHIEH PAN
2Patents
1h-index
8Co-inventors
27Inventor score
Filing activity: Dec 3, 2015 → Nov 3, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9875984B2 | Substrate surface metallization method and substrate having metallized surface manufactured by the same | Electricity | 1 | Active |
| US9514965B2 | Substrate surface metallization method and substrate having metallized surface manufactured by the same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.