Substrate surface metallization method and substrate having metallized surface manufactured by the same
US9514965B2 · kind B2 · utility
1Cited by
2References
9Claims
0Family size
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Key dates
| Filing date | Dec 3, 2015 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Dec 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate having metallized surface is provided. The substrate having metallized surface includes a silicon substrate, an adhesive layer and a metallic layer. The silicon substrate has a silanated surface and the adhesive layer is disposed on the silanated surface. The metallic layer bonds to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups each include at least one metallic nanoparticle capped with at least one polymer, and the metallic layer and the adhesive layer have chemical bonds formed there between.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.