Tuck Boon Chan
2Patents
2h-index
5Co-inventors
33Inventor score
Filing activity: Feb 20, 2014 → Jun 25, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9922161B2 | IC layout adjustment method and tool for improving dielectric reliability at interconnects | Emerging Cross-Sectional Technologies | 9 | Active |
| US11177805B1 | Reducing glitch power in digital circuits | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.