Tzu-Hui Chen
5Patents
3h-index
8Co-inventors
39Inventor score
Filing activity: Oct 14, 2010 → Aug 6, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8569894B2 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Emerging Cross-Sectional Technologies | 19 | Active |
| US8884424B2 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Emerging Cross-Sectional Technologies | 7 | Active |
| US8786062B2 | Semiconductor package and process for fabricating same | Electricity | 5 | Active |
| US9165900B2 | Semiconductor package and process for fabricating same | Electricity | 2 | Active |
| US9196597B2 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.