Ursula Meyer
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Jul 23, 2012 → Jul 23, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8841768B2 | Chip package and a method for manufacturing a chip package | Electricity | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.