Vijendran M
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: May 8, 2001 → May 8, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6656769B2 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Electricity | 19 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.