Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
US6656769B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | May 8, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for distributing a mold material in a mold for packaging microelectronic devices. In one embodiment, the microelectronic devices are placed on a substrate and the substrate is at least partially enclosed by the device region of a mold cavity. A mold material is passed along a flow axis through at least one entrance port into an intermediate region of the mold. The mold material is then passed from the intermediate region into the device region through a single opening spaced apart from and positioned between the entrance port and the microelectronic device. The single opening has a flow area transverse to the flow axis smaller than a flow area immediately upstream of the single opening to restrict the flow through the single opening. The mold material can accordingly form a uniform leading edge as it exits the opening and before it impinges on the microelectronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.