Viktor Heitzler
2Patents
1h-index
3Co-inventors
41Inventor score
Filing activity: Aug 4, 1989 → Oct 9, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5083193A | Semiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facility | Electricity | 2 | Expired |
| US9620391B2 | Electronic component with a leadframe | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.