Wayne Anthony Sozansky
6Patents
4h-index
16Co-inventors
54Inventor score
Filing activity: May 26, 1994 → Oct 6, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5953814A | Process for producing flip chip circuit board assembly exhibiting enhanced reliability | Emerging Cross-Sectional Technologies | 50 | Expired |
| US5461008A | Method of preventing aluminum bond pad corrosion during dicing of integrated circuit wafers | Emerging Cross-Sectional Technologies | 42 | Expired |
| US5545915A | Semiconductor device having field limiting ring and a process therefor | Emerging Cross-Sectional Technologies | 32 | Expired |
| US6045032A | Method of preventing solder reflow of electrical components during wave soldering | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5672528A | Method for making semiconductor device having field limiting ring | Emerging Cross-Sectional Technologies | 2 | Expired |
| US11961670B1 | System including a bent capacitor bus bar | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.