Method of preventing aluminum bond pad corrosion during dicing of integrated circuit wafers
US5461008A · kind A · utility
42Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1994 |
| Grant date | Oct 24, 1995 |
| Priority date | — |
| Expiry date | May 26, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0443
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of suppressing adherence of silicon particles to IC bond pads, and corrosion thereof, during the dicing of silicon wafers by sawing. An anion of an organic acid is added to saw coolant water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.