Wei Hong
4Patents
1h-index
12Co-inventors
37Inventor score
Filing activity: Apr 29, 2015 → Sep 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10823630B1 | High sensitivity MEMS pressure sensor | Physics | 1 | Active |
| US10669187B2 | Pink aluminosilicate glass | Chemistry; Metallurgy | 0 | Active |
| US11506553B1 | High sensitivity MEMS pressure sensor | Physics | 0 | Active |
| US11171036B2 | Preventing dielectric void over trench isolation region | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.