Wei Ling
2Patents
2h-index
7Co-inventors
33Inventor score
Filing activity: Jan 25, 2008 → Jan 30, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8913391B2 | Board-level heat transfer apparatus for communication platforms | Emerging Cross-Sectional Technologies | 7 | Active |
| US7905105B2 | Modular in-frame pumped refrigerant distribution and heat removal system | Mechanical Engineering; Lighting; Heating | 7 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.