Board-level heat transfer apparatus for communication platforms
US8913391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2012 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Aug 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit boards being held against a portion of the cooler by a corresponding force, some of the electronic circuit boards having a localized heat source thereon The apparatus also comprises a plurality of heat spreaders, each heat spreader configured to form a heat conducting path over and adjacent to one of the electronic circuit boards from one or more of the localized heat sources thereon to the portion of the cooler. The apparatus also comprises a plurality of compliant thermal interface pads, each of the pads being compressed between end of one of the heat spreaders and the portion of the cooler to form a heat conduction path therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.