Wei-Sen Tang
3Patents
2h-index
2Co-inventors
30Inventor score
Filing activity: Jul 31, 2000 → Sep 2, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6291264A | Flip-chip package structure and method of fabricating the same | Electricity | 52 | Expired |
| US6400036B1 | Flip-chip package structure and method of fabricating the same | Electricity | 28 | Expired |
| US7375736B2 | Test method for VGA with overclock frequency and a VGA system thereof | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.