Wei Weng
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Jun 25, 2015 → Jun 25, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9556363B2 | Copper barrier chemical-mechanical polishing composition | Chemistry; Metallurgy | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.