WEI ZENG
4Patents
1h-index
7Co-inventors
37Inventor score
Filing activity: Sep 17, 2009 → Nov 4, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8457775B2 | Method for defining a uniform injection molding interface and an injection molding system using the same | Physics | 2 | Active |
| US12192313B2 | Method, device, system, and storage medium for establishing local communication link | Electricity | 0 | Active |
| US10543510B2 | Method for modifying surface of non-conductive substrate and sidewall of micro/nano hole with rGO | Chemistry; Metallurgy | 0 | Active |
| US8814551B2 | Positioning control ejection mechanism and turntable device using same | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.