Wenbin Qu
3Patents
2h-index
9Co-inventors
37Inventor score
Filing activity: May 17, 2010 → Sep 2, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9105647B2 | Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material | Electricity | 5 | Active |
| US11444001B1 | Thermoelectric semiconductor device and method of making same | Electricity | 3 | Active |
| US11901260B2 | Thermoelectric semiconductor device and method of making same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.