Thermoelectric semiconductor device and method of making same
US11444001B1 · kind B1 · utility
3Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2021 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | May 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermoelectric semiconductor device includes a heat dissipating semiconductor module and a stack of flash memory dies mounted on a substrate. The heat dissipating module comprises a first semiconductor die such as a controller, and a second semiconductor die such as a thermoelectric semiconductor die to cool the first semiconductor die during operation. The thermoelectric semiconductor die may be mounted to the controller die at the wafer level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.